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| PRODUCT | DOUBLE-SIDED, MULTI-LAYER, RIGID-FLEX, FLEX | SINGLE-SIDED |
| Laminate | FR4, High TG Epoxy, High Frequency, Halogen Free, Rogers, Arlon, Taconic, PTFE | FR2, CEM1, CEM3 and FR4 |
| Finished PCB Thickness | 0.127 to 7mm (5 to 276mil) | 0.50 to 2.40mm (20 to 96mil) |
| Circuit Layers |
2 Double Sided 4 to 40 with Blind and Buried Vias 18 (Rigid Flex) Flex ( Single Sided , Double Sided, Multilayer) |
1 Single Sided 2 with Silver Paste THP Vias only |
| Copper Thickness | 9μM, 12μM, 17.5μM, 35μM, 70μM, 105μM | FR4 - 35μM, 70μM CEM, FR2 - 35μM |
| Min. Line Width/Space (Inner Layer) | 0.064 / 0.064mm (2.5/2.5mil) | 0.127mm (5 / 5mil) |
| Min. Line Width/Space (Outer Layer) | 0.064 / 0.064mm (2.5/2.5mil) | |
| Min via to conductor spacing (Rigid MLB) | 0.127mm (5mil) | |
| Min via to conductor spacing (Rigid-Flex) | 0.178mm (7mil) | |
| Min. Finished Hole Size (Mechanical) | 0.10mm (4mil) | 0.50mm (28mil) |
| Min. Finished Hole Size (HDI Laser) |
0.076mm (3mil) | |
| Aspect ratio | 01:08 | not applicable |
| Standard Panel Sizes | 530 x 610mm 610 x 610mm 457 x 610mm |
530 x 610mm |
| Electrical Test (SMT pitch) | 0.25mm (10mil) | 0.25mm (10mil) |
| Surface Finishes |
Hot Air Solder Level Organic Surface Preparation Immersion Nickel Gold Immersion Silver Lead Free HASL Conductive Carbon |
Hot Air Solder Level Organic Surface Preparation Immersion Nickel Gold Immersion Silver Lead Free HASL Conductive Carbon Silver Paste THP Vias |
| Soldermask | Liquid Photo Image-able Peelable Mask | Liquid Photo Image-able Peelable Mask UV Cured Screen Print |
| Profiling Methods | V-Score, NC Routing, Router Tab, Punching and Punch & Push-back | V-Score, NC Routing, Router Tab, Punching and Punch & Push-back |
| Warp & Twist | 0.70% | 1% |
| Special Techniques |
HDI PCB Heavy Copper (210μM) Impedance Control ±7% |
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