Quality is Our Name.
There are few parts in an electronic device that have such an impact on the final product as the printed circuit board. At first sight, PCBs differ little in appearance, irrespective of their inherent qualities. It is under the surface that we focus on the differences so critical to the PCBs’ durability and functionality. Customers cannot always see the difference, but they can rest assured that Cirtech Electronics puts a great deal of effort into ensuring that their customers are supplied with PCBs that meet the most stringent quality standards.
The information below details some of the key capabilities that Cirtech Electronics can offer and support today. You will find information here relating to the specific materials we can support, the PCB technologies or product types which we currently produce, as well as some of the tolerances which we can achieve.
Multilpe layers of epoxy glass fiber bonded together with multiple layers of copper of varying thicknesses.
Multilayer boards with a higher connection pad density than standard boards, with finer lines/spaces, smaller via holes and capture pads allowing microvias to only penetrate select layers and also be placed in surface pads.
Controlled impedance, low loss materials, miniaturization.
Effective heat sink solutions for thermal applications. This construction type enables superior heat dissipation through use of either aluminium or copper substrate bonded to the insulated circuitry.
Mainly polyimide materials, flex PCB’s are necessary when motion of the PCB is needed, when 3-D interconnections are necessary (i.e. replacing cables and connectors) or when these are both combined due to limited available space.
Mixed materials including RF and high speed, standard FR-4, polyimide flex. Adhesiveless or adhesive based polyimide flex constructions, with cover coat or flexible solder mask materials.
The process uses controlled depth routing of the FR-4 to achieve a flexible / bending section within a traditionally rigid FR-4. Only suitable for static operations – bends typically just for installation. A lower cost solution for some very specific “flex-to-fit”applications.
Epoxy glass dielectric materials laminated with copper cladding of varying thicknesses.