High Density Interconnect PCBs

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8L HDI – materials: FR-4; board thickness: 2.00mm; hole size: 0.20mm; aspect ratio: 10:1, copper thickness inner and outer layers: 35/35 μm; line width and space: 0.9/0.9mm; surface treatment: ENIG; features: fine pitch BGA, controlled impedance

 

HDI PCBs – Technical specification


Feature Technical specification
Number of layers 4 – 22 layers standard, 30 layers advanced
Technology highlights Multilayer boards with a higher connection pad density than standard boards, with finer lines/spaces, smaller via holes and capture pads allowing microvias to only penetrate select layers and also be placed in surface pads.
HDI builds 1+N+1, 2+N+2, 3+N+3,4+N+4, any layer in R&D
Materials FR4 standard, FR4 high performance, Halogen free FR4, Rogers
Copper weights (finished) 18μm – 70μm
Minimum track and gap 0.075mm / 0.075mm
PCB thickness 0.40mm – 3.20mm
Maxmimum dimensions 610mm x 450mm; dependant upon laser drilling machine
Surface finishes available OSP, ENIG, Immersion tin, Immersion silver, Gold fingers
Minimum mechanical drill 0.15mm
Minimum laser drill 0.10mm standard, 0.075mm advanced