The multilayer PCB segment is by far our leading product. Our proven track record of high quality and on-time delivery performance highlights our dedication to customer satisfaction.
Please contact Cirtech Electronics if you need further information or assistance, we are happy to help you.
Multilayer PCBs – Technical Specification
|Number of layers||4 – 22 layers standard, 30 layers advanced, 40 layers prototype.|
|Technology highlights||Multilpe layers of epoxy glass fiber bonded together with multiple layers of copper of varying thicknesses.|
|Materials||High performance FR4, halogen-free FR4, low loss and low Dk materials|
|Copper weights (finished)||18μm – 210μm, advanced 1050μm / 30oz|
|Minimum track and gap||0.075mm / 0.075mm|
|PCB thickness||0.40mm – 7.0mm|
|Maxmimum dimensions||580mm x 1080mm, advanced 610mm x 1400mm|
|Surface finishes available||HASL (SnPb), LF HASL (SnNiCu), OSP, ENIG, Immersion Tin, Immersion Silver, Gold fingers|
|Minimum mechanical drill||0.20mm|