Radio-frequency (RF) and microwave (MW) circuits can be found in countless wireless products from handheld devices for medical and industrial applications to advanced communications systems for base stations, radar and global positioning. The success of these high-speed products begins at the product design stage when the PCB laminate materials are selected. Cirtech Electronics works with the product design team to ensure that the project’s cost/performance targets can be met by providing information on material options, relative costs and DfM considerations. Once the design has been completed, Cirtech Electronics follows the boards from prototype through to production where key process variables such as line widths and dielectric spacing are measured and controlled to insure the product meets the designed requirements and delivers consistent performance throughout the products life cycle.
Please contact Cirtech Electronics if you need further information or assistance, we are happy to help you.
Radio Frequency PCBs – Technical specification
|Number of layers||2-20 layers|
|Technology highlights||Controlled impedance, low loss materials, miniaturization|
|Materials||Low loss / low Dk, higher performance FR-4, PPO, Teflon, hydrocarbon / ceramic filled|
|Dielectric thickness||0.1mm – 3.0mm|
|Profile method||Routing, v-score|
|Copper weights (finished)||½ to 6 ounce|
|Minimum track and gaps||0.075mm / 0.075mm|
|Metal core thickness||0.4-2mm post bonded|
|Maximum dimensions||580mm x 1010mm|
|Surface finishes available||HASL (Lead-free), OSP, ENIG, Immersion tin, Immersion silver|