Rigid-flex is a complicated product that demands a lot of interaction between the PCB provider and the customers. Like other complex products, early discussions between Cirtech Electronics and the designer is necessary to optimize the design for manufacturability and to optimize costs.
Please contact Cirtech Electronics if you need further information or assistance, we are happy to help you.
Rigid-Flex PCBs – Technical specification
|Number of layers||4-16 layers|
|Technology highlights||Mixed materials including RF and high speed, standard FR-4, polyimide flex. Adhesiveless or adhesive based polyimide flex constructions, with cover coat or flexible solder mask materials.|
|Bending performance||Based on the specific design, the bend performance can range from a basic 90 °bend to fit to a full dynamic flex with 360° range of motion in the flex tail that will withstand continuous cycles throughout the product life.|
|Bend features||Bend radius controls the flexibility of the flex portion of the board. The thinner the material the lower the bend radius and the more flexible the flex section.|
|Materials||RA copper, THE copper, FR-4, polyimide, adhesive|
|Copper weights (finished)||½ ounce, 1 ounce, 2 ounce, 3 ounce|
|Minimum track and gap||0.075mm / 0.075mm|
|PCB thickness||0.4mm to 3mm|
|PCB thickness in flex section||0.05mm to 0.8mm|
|Maxmimum dimensions||457mm to 610mm|
|Surface finishes available||ENIG, OSP Immersion tin, Immersion silver|
|Minimum mechanical drill||0.20mm|