| PRODUCT |
DOUBLE-SIDED MULTI-LAYER |
SINGLE-SIDED |
| Laminate |
FR4, High TG Epoxy and High Frequency |
FR2, CEM1, CEM3 and FR4 |
| Finished PCB Thickness |
0.20 to 3.20mm (8 to 128mil) |
0.50 to 2.40mm (20 to 96mil) |
| Circuit Layers |
2 Double Sided
4 to 24 with Blind and Buried Vias |
1 Single Sided
2 with Silver Paste THP Vias only |
| Copper Thickness |
9μM, 12μM, 17.5μM, 35μM, 70μM, 105μM |
FR4 - 35μM, 70μM
CEM, FR2 - 35μM |
| Min. Line Width/Space |
0.09 / 0.09mm (3.5 / 3.5mil) |
0.20 / 0.20mm (8 / 8mil) |
| Min. Finished Hole Size |
0.20mm (8mil) |
0.50mm (28mil) |
| Aspect ratio |
01:08 |
not applicable |
| Standard Panel Sizes |
530 x 610mm
610 x 610mm
457 x 610mm |
530 x 610mm |
| Electrical Test (SMT pitch) |
0.25mm (10mil) |
0.25mm (10mil) |
| Controlled Impedance |
±7% |
not applicable |
| Surface Finishes |
Hot Air Solder Level
Organic Surface Preparation
Immersion Nickel Gold
Flash Nickel Gold
Immersion Silver
Conductive Carbon |
Hot Air Solder Level
Organic Surface Preparation
Immersion Nickel Gold
Immersion Silver
Conductive Carbon
Silver Paste THP Vias |
| Soldermask |
Liquid photo image-able peelable mask |
Liquid Photo Image-able Peelable Mask
UV Cured Screen Print |
| Profiling Methods |
V-Score, NC Routing, Punching and Punch & Push-back |
V-Score, NC Routing, Punching and Punch & Push-back |
| Warp&Twist |
0.7% |
1% |
