Pyralux® AP Copper-Clad Laminate 

DuPont™ Pyralux® AP is an all polyimide double sided copper clad laminate that is the industry standard in terms of thermal, chemical and mechanical properties. It is ideal for use in rigid flex and multilayer flex applications which require advanced performance, such as low dissipation loss for high speed, high frequency, thermal resistance and high reliability. These clads provide designers and fabricators outstanding options in building circuits with high reliability and yield for controlled impedance and high-performance applications. 

Features: 

• Low CTE for rigid flex multilayers 

• Superior electrical performance and signal integrity (Dk = 3.4, Df = 0.002) 

• Robust thermal resistance 

• High tear and peel strengths 

• Excellent dielectric thickness tolerance 

• Low outgassing, NASA data available 

• Halogen free 

Constructions: 

• Available in polyimide thicknesses of 0.5, 1.0, 2.0, 3.0, 4.0, 5.0, and 6.0 mils; 7.0-20 mils available upon special request 

• Available in copper thicknesses of 6, 9, 12, 18, 35, and 70 microns; thicker copper available upon special request 

• Available in copper types RA, ED, and DT(RA) 

• Custom sizes available in up to 85 inches in length 

Certifications: 

• UL 94 V-0 flammability rating 

• UL maximum operating temperature (MOT) 200°C 

• Certified to IPC 4204A/11