Conventional Series 

Low Dk/Df laminate & prepreg 

Laminate: Getek 

Product Description: 

Getek materials provide the low dielectric constant (Dk) and low dissipation factor (Df) performance demanded by high speed; low loss Printed Wiring Board (PWB) designs and applications, while providing superior thermal performance and high reliability base on the systems 180C glass transition temperature (Tg).  

Getek laminate and prepreg products are manufactured using a functionalized, Polyphenylene Oxid (PPO)/epoxy resin, reinforced with electrical grade (E-class) glass fabric. In addition to this superior electrical and thermal performance, the mechanical, chemical and lows moisture absorption properties all equal or exceed the performance of traditional FR-4 materials. The Getek system is also UV blocking and fluorescing. 

Product Features & Benefits: 

• High thermal performance 

• Tg: 180C (DMA) 

• Low CTE for reliability 

• T260 > 30mins 

• T288 > 10mins 

• RoHS compliant 

• Improved dielectric properties 

• Dk < 3.8 (50Mhz to 1GHz) 

• Supports increased signal speeds 

• Df < 0.010 (50MHz to 1GHz) 

• Provides better signal integrity 

• UV blocking and AOI fluorescence 

• High throughput and accuracy during PCB fabrication and assembly 

• Superior processing 

• Closest to conventional FR-4 processing of all high speed materials 

• Core material standard availability 

• Roll or panel form 

• Tooling of prepreg panels available  

• Copper foil type availability 

• Standard HTE grade 3 

• RTF (Reverse treat foil) 

• Copper weights 

• ½, 1 and 2 oz (18, 38, 70 um) available 

• Heavier copper available upon request 

• Thinner copper foil available upon request 

• Glass fabric availability  

• Standard e-glass 

• Square weave glass fabric available 

• Industry approvals 

• IPC-410C /25 

• UL File number E41625 

• Qualified to UL’s MCIL program