R-F775

Laminate – Flex

Felios Series

Adhesiveless Flexible Laminates 

Panasonic Felios is the ideal choice for technically advanced multi-layer, rigid-flex, double and single-sided applications. Felios Flex is an engineered, all polyimide substrate with premium copper foil bonded on either one or two sides. 

Double-sided copper clad R-F775 
Single-sided copper clad R-F770 

Applications:

Avionics/Space 
Industry 
Automotive 

STANDARD PRODUCT LINE FEATURES 

  • Thin Flexible Circuit Board Materials with a low modulus polyimide 
  • Segment-leading dimensional stability and thermal performance (R-F775) 
  • Halogen-free (Adhesiveless) 
  • Polyimide Thickness available: 12.5µm – 150µm (0.5-6 mil) 
  • Copper Foil: 9-70µm RA (1/4 -2 oz), 2-35µm ED (2µm – 1 oz) 
  • Mil-spec approved and passes NASA outgassing specification 
  • Standard panel sizes: 18×12″G, 18×24″G, 24×36″G. Rolls and custom panel sizes available. 
  • Conforms to IPC 4204/11 specifications; UL 94V0, RoHS, and REACH compliant. 

 

Property
Value
Dielectric Constant Dk @ 10GHz
-
Copper Type
RA/ED
Dielectric Thickness um
6.0
Dielectric Constant Dk @ 10GHz: -
Copper Type: RA/ED
Dielectric Thickness um: 6.0

Applications

Avionics
Space
Automotive Industry

Clusters

Aerospace Cluster
Automotive Cluster
Electronics Cluster
Industrial Cluster
Maritime Cluster
Medical Cluster
Telecommunications Cluster
Tracking Cluster

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Get a Quote

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(Data dump)

Type: Laminate – Flex
Dielectric Constant Dk @ 1GHz: 3.2
Dielectric Constant Dk @ 10GHz: -
Loss Tangent (Df) @ 1MHz: 0.003
CTE (Z) (ppm/°C): 50/200
CTE (XY) (ppm/°C): 50/200
Lead Free compliant: Yes
Copper Type: RA/ED
SS/DS: SS/DS
Dielectric Thickness um (mil): 6.0
Space Outgas Compliant: Yes

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