Conventional Series 

Laminate: Tachyon-100G 

Product Description: 

Tachyon 100G materials exhibit exceptional electrical properties that are very stable over a broad frequency and temperature range between -55°C and +125°C up to 100GHz. These electrical properties provide designers a scalable solution for next generation designs of backplanes and daughter cards, enabling 10x improvements from 10 Gb/s data rates. Isola has developed Tachyon 100G with the highest level of thermal performance for high layer count line cards. The very low Z-axis CTE makes it a perfect choice for fine pitch BGA applications. The material is optimized with the use of spread glass to mitigate skew, improve rise times, reduce jitter, and increase eye width/height and that use ultra smooth HVLP (VLP2) 2um Rz copper that significantly reduces conductor losses. 

Product Attributes: 

• High density interconnect 

• High speed digital 

• High thermal reliability 

Product Features: 

• UL File Number: E41625 

• RoHS Compliant 

• CAF resistant 

• Low moisture absorption 

• 6x 260°C reflow capable 

• 6x 288°C solder float capable 

• Multiple lamination cycles 

• HDI technology compatible 

Product Availability: 

Standard Material Offering: Laminate 

• 2 to 20 mil (0.05 to 0.51 mm) 

Copper Foil Type 

• HVLP3 (VLP1) ≤1.1 micron Rz JIS 

• HVLP (VLP2) ≤2.5 micron Rz JIS 

• Advanced RTF ≤2.5 micron Rz JIS 

• Embedded resistor foil 

Copper Weight 

• ½, 1 and 2 oz (18, 35 and 70 μm) available 

• Heavier copper foil available 

• Thinner copper foil available 

Standard Material Offering: Prepreg 

• Tooling of prepreg panels 

• Moisture barrier packaging 

• Glass Fabric Availability 

• Low Dk Glass -Asahi Japan, Asahi 

• Tawian, TGI Taiwan 

• Square weave glass 

• Mechanically spread glass 

Typical Market Applications: 

• Networking & Communications 

• Aerospace & Defence 

• Computing, Storage & Peripherals