Rigid-flex is a complicated product that demands a lot of interaction between the PCB provider and the customers. Like other complex products, early discussions between Cirtech Electronics and the designer is necessary to optimize the design for manufacturability and to optimize costs.
A Rigid-Flex Printed Circuit Board combines elements of both rigid and flexible PCB technologies. This hybrid board features rigid PCB areas interconnected with flexible PCB regions, allowing for a versatile design that can fit into tight or unconventional spaces.
Construction and Composition
Rigid-flex PCBs are constructed by integrating layers of rigid PCBs with flexible circuit substrates. The flexible layers are typically made of flexible plastic materials like polyimide with conductive copper circuits. The rigid sections are similar to standard PCBs, often made of fiberglass-reinforced epoxy laminate.
Advantages and Typical Applications
The Rigid-Flex PCB design offers significant benefits: it reduces the need for multiple interconnects, enhances the board’s reliability, and allows for more complex designs. These PCBs are particularly valuable in high-density applications like smartphones, advanced cameras, and aerospace electronics. Their adaptability makes them ideal for products requiring robustness and the ability to fit into compact or mechanically stressful environments.
Advantages and Common Uses:
The primary advantage of Semi-Flex PCBs is their cost-effectiveness, as they provide some flexibility without the higher cost of fully flexible materials. They are ideal for applications requiring minor bending or curvature, such as in certain consumer electronics, automotive components, and industrial devices. Semi-Flex PCBs are often used where a small degree of bending is needed for installation or maintenance, but the PCB will remain primarily stationary during operation.
Feature | Technical specification |
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Number of layers | 4-16 layers |
Technology highlights | Mixed materials including RF and high speed, standard FR-4, polyimide flex. Adhesiveless or adhesive based polyimide flex constructions, with cover coat or flexible solder mask materials. |
Bending performance | Based on the specific design, the bend performance can range from a basic 90 °bend to fit to a full dynamic flex with 360° range of motion in the flex tail that will withstand continuous cycles throughout the product life. |
Bend features | Bend radius controls the flexibility of the flex portion of the board. The thinner the material the lower the bend radius and the more flexible the flex section. |
Materials | RA copper, HTE copper, FR-4, polyimide, adhesive |
Copper weights (finished) | ½ ounce, 1 ounce, 2 ounce, 3 ounce |
Minimum track and gap | 0.075mm / 0.075mm |
PCB thickness | 0.4mm to 3mm |
PCB thickness in flex section | 0.05mm to 0.8mm |
Maximum dimensions | 457mm to 610mm |
Surface finishes available | ENIG, OSP Immersion tin, Immersion silver |
Minimum mechanical drill | 0.20mm |
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