DuPont™ Pyralux® AP is a Double-sided Copper-clad Laminate featuring an adhesive-less, all-polyimide dielectric layer. This material is ideal for multilayer flex and rigid-flex applications that required advanced performance, including low loss properties for excellent signal integrity and thermal resistance for high reliability. Available in a range of conductor and dielectric thicknesses, Pyralux® AP clads provide designers and fabricators outstanding options for fabricating high performance circuits.
DuPont™ Pyralux® AP Double-side Clad are fully compatible with all conventional flexible circuit fabrication processes, including oxide treatment and wet chemical plated-through-hole desmearing. Fabricated circuits can be cover coated and laminated together to form multilayers or bonded to heat sinks using polyimide, acrylic, or epoxy adhesives. Pyralux® AP
