Via Tenting – Plugging and Filling

VIA STRUCTURES, COVERING, PLUGGING, AND FILLING OPTIONS Via hole plugging is a PCB manufacturing technique in which the via hole is filled with a solder mask or epoxy. This process partially or completely closes the via hole using conductive or non-conductive filling material. Filling via holes results in more reliable surface mounts, provides better assembly […]

Surface Finishes

Storage Guidelines For Bare Printed Circuit Boards

STORAGE GUIDELINES FOR BARE (UNPOPULATED) PCB’S The shelf life of pcb’s are dependent on the storage conditions as well as the surface finish. The laminate material is sensitive to moisture absorption and the surface finish of the pcb’s can be affected by contamination and oxidation. Flex and flex-rigid pcb’s are more prone to moisture absorption […]

Rigid Stack Up

RIGID STACK UP 4 LAYER RIGID STACK UP 6 LAYER RIGID STACK UP 8 LAYER RIGID STACK UP 10 LAYER RIGID STACK UP 12 LAYER

Recommendation For Baking Of Flex And Rigid-Flex PCB’s

Nearly all Flex and Rigid-Flex boards are constructed using a polyimide material. This material is naturally hydroscopic, which means that it easily and readily absorbs moisture. It is therefore strongly recommended that flex and flex-rigid boards be baked to reduce the moisture content prior to any assembly process that requires soldering. Risks such as delamination, […]

Edge Plating and Castellations

Edge plating or castellation refers to the copper plating that runs from the top to the bottom surfaces of the circuit board and extends to at least one of the perimeter edges. Essentially, both edge plating and castellation processes take place during through-hole plating, the routing for the castellations where the “half holes” are created […]

Conductive Anodic Filament (CAF)

What is CAF? Conductive Anodic Filament (CAF) is a phenomenon that can occur in printed circuit boards (PCBs) where electromigration by means of a copper salt filament takes place between two points (anode to cathode) inside the pcb and is related to the failure of the board due to the formation of conductive traces between […]

Capacitance

Capacitance refers to a fundamental electrical property that describes the PCB’s or its components’ ability to store an electric charge. It is a crucial parameter in PCB design and can have significant implications on the functionality and performance of electronic circuits. Capacitance is measured in units called Farads (F), which represent the amount of charge […]

Aspect Ratio

The aspect ratio relates to a ratio based on a hole length relative to the same hole diameter on a pcb. This includes through-hole plated holes, blind vias, buried vias, and micro vias. The aspect ratio applies to both mechanically and laser-drilled holes. It is an essential parameter in PCB design and manufacturing, as it […]